Heat Sinks

制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
530101B00100G

530101B00100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

3,108
RFQ
530101B00100G

Datasheet

- Bulk Active Board Level, Vertical TO-218, TO-247 Bolt On and Board Mounts Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
6299BG

6299BG

6299BG

Boyd Laconia, LLC

2,897
RFQ

-

- Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.638" (41.60mm) 0.992" (25.20mm) - 2.000" (50.80mm) - - 6.70°C/W Aluminum Black Anodized
7129DG

7129DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

4,159
RFQ
7129DG

Datasheet

- Bulk Active Board Level TO-220 Clip Rectangular, Fins 1.040" (26.42mm) 0.866" (22.00mm) - 0.375" (9.52mm) 3.5W @ 70°C 7.00°C/W @ 500 LFM 19.20°C/W Copper Tin
374424B60023G

374424B60023G

374424B60023G

Boyd Laconia, LLC

3,104
RFQ

-

- Bulk Active Top Mount BGA, FPGA Solder Anchor Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) 3.0W @ 50°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
580200W00000G

580200W00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

2,045
RFQ
580200W00000G

Datasheet

- Bulk Active Top Mount 14-DIP and 16-DIP Press Fit and PC Pin Rectangular, Fins 0.890" (22.61mm) 0.600" (15.24mm) - 0.410" (10.42mm) 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
FIT0818

FIT0818

BLACK ALUMINUM HEATSINKKIT FOR R

DFRobot

3,911
RFQ

-

- Bulk Active Top Mount Raspberry Pi 4B Thermal Tape, Adhesive (Included) Rectangular, Pin Fins - - - - - - - Aluminum -
628-25ABT1E

628-25ABT1E

HEATSINK FOR 45MM BGA

Wakefield-Vette

4,423
RFQ
628-25ABT1E

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
E3A-T220-25E

E3A-T220-25E

BLACK ANODIZED HEATSINK

Ohmite

1,381
RFQ
E3A-T220-25E

Datasheet

EX Bulk Active Board Level Bridge Rectifiers Bolt On Square, Fins 1.000" (25.40mm) 1.000" (25.40mm) - 1.000" (25.40mm) - - 12.40°C/W Aluminum Black Anodized
628-65ABT5

628-65ABT5

HEATSINK CPU 43MM SQ BLK H=.65"

Wakefield-Vette

4,636
RFQ
628-65ABT5

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
SW25-2G

SW25-2G

THM,ZA3286 REV 6 SW25-2G

Boyd Laconia, LLC

2,038
RFQ

-

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) 2.0W @ 30°C 6.00°C/W @ 400 LFM 13.00°C/W Aluminum Black Anodized
KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

Boyd Laconia, LLC

3,282
RFQ

-

- Bulk Active - - - - - - - - - - - - -
VXV-55-101E

VXV-55-101E

EXTRUDED HEATSINK 55MM SOT-227

Ohmite

1,296
RFQ
VXV-55-101E

Datasheet

VX Box Obsolete Board Level SOT-227 Bolt On Rectangular, Angled Fins 1.917" (48.70mm) 2.165" (55.00mm) - 1.181" (30.00mm) - - - Aluminum Degreased
1542500-1

1542500-1

HTS795-1=HS UPLTD

TE Connectivity AMP Connectors

3,637
RFQ

-

- Bag Active - - - - - - - - - - - - -
DV-T268-101E-TR

DV-T268-101E-TR

TO-268 HEAT SINK /POLY TAPE

Ohmite

1,297
RFQ
DV-T268-101E-TR

Datasheet

D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.400" (10.16mm) 5.0W @ 35°C 6.00°C/W @ 600 LFM - Aluminum Degreased
DV-T268-401E-TR

DV-T268-401E-TR

TO-268 SMD HEAT SINK

Ohmite

2,574
RFQ
DV-T268-401E-TR

Datasheet

D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.460" (11.68mm) 9.0W @ 43°C 5°C/W @ 500 LFM - Aluminum Degreased
DV-T263-401E-TR

DV-T263-401E-TR

TO-263 SMD HEAT SINK

Ohmite

3,982
RFQ
DV-T263-401E-TR

Datasheet

D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.460" (11.68mm) 7.0W @ 45°C 7°C/W @ 500 LFM - Aluminum Degreased
TV58G

TV58G

THM,ZA2102 ISS 4 TV-58G

Boyd Laconia, LLC

3,185
RFQ

-

- Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.887" (22.53mm) 0.749" (19.03mm) - 0.433" (11.00mm) 1.5W @ 50°C 14.00°C/W @ 400 LFM 30.00°C/W Aluminum Black Anodized
241804B91200G

241804B91200G

241804B91200G

Boyd Laconia, LLC

2,979
RFQ

-

- Bulk Active Top Mount Eighth Brick DC/DC Converter Bolt On Rectangular, Fins 2.280" (57.90mm) 0.902" (22.90mm) - 0.449" (11.40mm) - 3.00°C/W @ 500 LFM 5.50°C/W - -
325705R00000G

325705R00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

4,344
RFQ
325705R00000G

Datasheet

- Bulk Active Board Level TO-5 Press Fit Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.250" (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Aluminum Red Anodized
10-5607-04G

10-5607-04G

10-5607-04G

Boyd Laconia, LLC

3,780
RFQ

-

- Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 1.470" (37.34mm) 1.470" (37.34mm) - 0.390" (9.91mm) 3.0W @ 70°C 7.00°C/W @ 200 LFM 22.10°C/W Aluminum Black Anodized
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