Heat Sinks

制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
628-35ABT4E

628-35ABT4E

HEATSINK FOR 45MM BGA

Wakefield-Vette

4,200
RFQ
628-35ABT4E

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.350" (8.89mm) 3.0W @ 50°C 10.00°C/W @ 150 LFM - Aluminum Black Anodized
PRT-11510

PRT-11510

SMALL HEATSINK

SparkFun Electronics

4,094
RFQ

-

- Bulk Discontinued at Digi-Key Top Mount Allegro A4983 - Rectangular, Fins 0.250" (6.35mm) 0.190" (4.83mm) - 0.300" (7.62mm) - - - - Black Anodized
V6560F

V6560F

PROFILE HEATSINK

Assmann WSW Components

2,871
RFQ

-

- Bulk Active - - - - - - - - - - - - -
E2A-T220-25E

E2A-T220-25E

BLACK ANODIZED HEATSINK

Ohmite

1,073
RFQ
E2A-T220-25E

Datasheet

EX Box Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 0.641" (16.28mm) 0.642" (16.30mm) - 1.000" (25.40mm) 2.0W @ 40°C 4.00°C/W @ 500 LFM 16.40°C/W Aluminum Black Anodized
628-65ABT1E

628-65ABT1E

HEATSINK FOR 45MM BGA

Wakefield-Vette

3,752
RFQ
628-65ABT1E

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
10-6327-01G

10-6327-01G

HEATSINK BGA W/PUSH PINS

Boyd Laconia, LLC

2,542
RFQ

-

- Bulk Active Top Mount BGA Push Pin Square 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 2.0W @ 60°C 9.30°C/W @ 200 LFM 30.60°C/W Aluminum Black Anodized
ATS-PCBM1106

ATS-PCBM1106

BOARD LEVEL HEAT SINK

Advanced Thermal Solutions Inc.

4,454
RFQ

-

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 1.00°C/W @ 200 LFM 3°C/W Aluminum Black Anodized
374624B00000G

374624B00000G

BGA HEAT SINK

Boyd Laconia, LLC

1,644
RFQ

-

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) - - - - 0.394" (10.00mm) 2.0W @ 50°C 6.00°C/W @ 300 LFM 23.40°C/W Aluminum Black Anodized
241802B92200G

241802B92200G

241802B92200G

Boyd Laconia, LLC

1,858
RFQ

-

- Bulk Active Top Mount Eighth Brick DC/DC Converter Bolt On Rectangular, Fins 2.280" (57.90mm) 0.902" (22.90mm) - 0.240" (6.10mm) - 3.00°C/W @ 600 LFM 5.60°C/W - -
241802B91200G

241802B91200G

241802B91200G

Boyd Laconia, LLC

3,361
RFQ

-

- Bulk Active Top Mount Eighth Brick DC/DC Converter Bolt On Rectangular, Fins 2.280" (57.90mm) 0.902" (22.90mm) - 0.240" (6.10mm) - 5.00°C/W @ 600 LFM 9.00°C/W - -
576403B00000G

576403B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

2,228
RFQ
576403B00000G

Datasheet

- Bulk Active Board Level TO-3 Bolt On Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 1.250" (31.75mm) 10.0W @ 50°C 1.50°C/W @ 600 LFM 5.10°C/W Aluminum Black Anodized
MBH15001-20L/1.7

MBH15001-20L/1.7

AL HEAT SINK 15X15X20MM

Malico Inc.

2,767
RFQ
MBH15001-20L/1.7

Datasheet

MBH Tray Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Fins 0.591" (15.01mm) 0.591" (15.00mm) - 0.776" (19.70mm) - - - Aluminum Alloy Black Anodized
HBH22031-13

HBH22031-13

AL HEAT SINK 22X22X13MM

Malico Inc.

4,061
RFQ

-

- Active - - - - - - - - - - - - -
WV-T264-101E

WV-T264-101E

HEATSINK W/CLIP FOR TO-264

Ohmite

4,618
RFQ
WV-T264-101E

Datasheet

W Box Obsolete Board Level, Vertical TO-264 Clip and PC Pin Rectangular, Fins 1.260" (32.00mm) 0.921" (23.40mm) - 0.630" (16.00mm) 1.0W @ 20°C 8.00°C/W @ 500 LFM 12.00°C/W Aluminum Unfinished
628-35ABT5

628-35ABT5

HEATSINK FOR 45MM BGA

Wakefield-Vette

1,909
RFQ
628-35ABT5

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.350" (8.89mm) 3.0W @ 50°C 10.00°C/W @ 150 LFM - Aluminum Black Anodized
593002B03400GW/LEAD IN @

593002B03400GW/LEAD IN @

593002B03400GW/LEAD IN @ .925

Boyd Laconia, LLC

2,693
RFQ

-

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.942" (23.92mm) 0.500" (12.70mm) - 1.180" (29.97mm) 1.0W @ 20°C 4.00°C/W @ 500 LFM 13.40°C/W Aluminum Black Anodized
642-60ABT4E

642-60ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,739
RFQ
642-60ABT4E

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
698-65AB

698-65AB

HEATSINK EXTRUSION 45MM

Wakefield-Vette

4,613
RFQ
698-65AB

Datasheet

698 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 2.100" (53.34mm) 2.100" (53.34mm) - 0.650" (16.51mm) - 2.50°C/W @ 300 LFM - Aluminum Black Anodized
CS9462510BM

CS9462510BM

25X25X10MM, T412

Cooling Source

3,136
RFQ

-

CS94 Box Active Top Mount - Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) - 5.71°C/W @ 200 LFM - Aluminum Black Anodized
7178DG

7178DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

1,852
RFQ
7178DG

Datasheet

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 0.6W @ 30°C 5.00°C/W @ 700 LFM 35.70°C/W Copper Tin
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