IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
36-6556-21

36-6556-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,385
RFQ
36-6556-21

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
APH-0428-G-H

APH-0428-G-H

APH-0428-G-H

Samtec Inc.

4,988
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0928-G-H

APH-0928-G-H

APH-0928-G-H

Samtec Inc.

4,786
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1428-G-H

APH-1428-G-H

APH-1428-G-H

Samtec Inc.

3,964
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1528-G-H

APH-1528-G-H

APH-1528-G-H

Samtec Inc.

4,465
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1928-G-H

APH-1928-G-H

APH-1928-G-H

Samtec Inc.

1,431
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0628-G-H

APH-0628-G-H

APH-0628-G-H

Samtec Inc.

4,761
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1228-G-H

APH-1228-G-H

APH-1228-G-H

Samtec Inc.

2,514
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0728-G-H

APH-0728-G-H

APH-0728-G-H

Samtec Inc.

1,288
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0828-G-H

APH-0828-G-H

APH-0828-G-H

Samtec Inc.

1,896
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0328-G-H

APH-0328-G-H

APH-0328-G-H

Samtec Inc.

4,617
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1828-G-H

APH-1828-G-H

APH-1828-G-H

Samtec Inc.

4,400
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1128-G-H

APH-1128-G-H

APH-1128-G-H

Samtec Inc.

3,146
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1728-G-H

APH-1728-G-H

APH-1728-G-H

Samtec Inc.

1,532
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-13-632-61-801000

110-13-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,223
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-320-61-801000

110-13-320-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,519
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-964-41-004000

612-43-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,926
RFQ
612-43-964-41-004000

Datasheet

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-964-41-004000

612-93-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,073
RFQ
612-93-964-41-004000

Datasheet

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-91-097-11-041003

510-91-097-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,586
RFQ
510-91-097-11-041003

Datasheet

510 Bulk Active PGA 97 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-83-223-18-091135

546-83-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

4,715
RFQ
546-83-223-18-091135

Datasheet

546 Bulk Active PGA 223 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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