IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
126-93-964-41-001000

126-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

3,177
RFQ
126-93-964-41-001000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-964-41-001000

126-43-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,474
RFQ
126-43-964-41-001000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-636-61-001000

110-13-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,838
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-640-61-006000

116-93-640-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,768
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
321-13-164-41-001000

321-13-164-41-001000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

4,328
RFQ
321-13-164-41-001000

Datasheet

321 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-43-145-15-081001

510-43-145-15-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,337
RFQ
510-43-145-15-081001

Datasheet

510 Tube Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-648-61-008000

116-43-648-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,700
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-87-419-19-001154

514-87-419-19-001154

CONN SOCKET PGA 419POS GOLD

Preci-Dip

4,491
RFQ
514-87-419-19-001154

Datasheet

514 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-192M16-001148

514-83-192M16-001148

CONN SOCKET BGA 192POS GOLD

Preci-Dip

2,353
RFQ
514-83-192M16-001148

Datasheet

514 Bulk Active BGA 192 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
712-13-264-41-001000

712-13-264-41-001000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.

1,295
RFQ
712-13-264-41-001000

Datasheet

712 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-83-223-18-091117

514-83-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,414
RFQ
514-83-223-18-091117

Datasheet

514 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
111-43-964-61-001000

111-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,185
RFQ

-

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-254-31-018000

714-43-254-31-018000

CONN IC DIP SOCKET 54POS GOLD

Mill-Max Manufacturing Corp.

3,685
RFQ
714-43-254-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 54 (2 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-432-61-007000

116-43-432-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,869
RFQ

-

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-964-41-003000

126-41-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,293
RFQ
126-41-964-41-003000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-964-41-003000

126-91-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,859
RFQ
126-91-964-41-003000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-C212-21

32-C212-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,414
RFQ
32-C212-21

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
614-83-175-16-072112

614-83-175-16-072112

CONN SOCKET PGA 175POS GOLD

Preci-Dip

1,496
RFQ
614-83-175-16-072112

Datasheet

614 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1420-G-R

APH-1420-G-R

APH-1420-G-R

Samtec Inc.

1,236
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0520-G-R

APH-0520-G-R

APH-0520-G-R

Samtec Inc.

4,692
RFQ

-

* - Active - - - - - - - - - - - - - - -
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