IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2C-2002CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
1,011 |
|
Datasheet |
XR2 | Bulk | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2A-4001-NCONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div |
3,765 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2T-2421-NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
2,859 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-6411-NI.C. CONNECTOR SOCKET Omron Electronics Inc-EMC Div |
3,047 |
|
- |
* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
XR2A-2815CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div |
1,860 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2C-1511-NCONN SOCKET SIP 15POS GOLD Omron Electronics Inc-EMC Div |
4,628 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2E-3204CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
4,559 |
|
Datasheet |
XR2 | Bulk | Obsolete | SIP | 32 (1 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2H-1611-NCONN ZIG-ZAG 16POS GOLD Omron Electronics Inc-EMC Div |
3,914 |
|
Datasheet |
XR2 | Bulk | Active | Zig-Zag | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2C-3200-HSGCONN IC SOCKET 32POS Omron Electronics Inc-EMC Div |
2,414 |
|
Datasheet |
XR2 | Bulk | Active | Housing | 32 (1 x 32) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-2402CONN Omron Electronics Inc-EMC Div |
2,800 |
|
- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
