IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2C-2005CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
3,952 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2A-4011-NCONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div |
3,960 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
XR2C-2000-HSGCONN IC SOCKET 20POS Omron Electronics Inc-EMC Div |
1,249 |
|
Datasheet |
XR2 | Bulk | Obsolete | Housing | 20 (1 x 20) | 0.100" (2.54mm) | - | - | Beryllium Copper | - | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2C-1611-NCONN SOCKET SIP 16POS GOLD Omron Electronics Inc-EMC Div |
2,759 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2C2611NCONN SOCKET SIP 26POS GOLD Omron Electronics Inc-EMC Div |
3,802 |
|
Datasheet |
XR2 | Bulk | Obsolete | SIP | 26 (1 x 26) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-1425CONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div |
3,172 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-1601-NIC CONNECTOR Omron Electronics Inc-EMC Div |
1,835 |
|
- |
* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
XR2A-2001-NCONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div |
4,736 |
|
Datasheet |
XR2 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2T-1621-NCONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div |
1,421 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-2201-NCONN IC DIP SOCKET 22POS GOLD Omron Electronics Inc-EMC Div |
3,012 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
