| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                     
                 
                
                 | 
				
                    MC33FS6527NAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS6525LAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS6503NAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc.  |  
                120 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 
| 
                 
                     
                 | 
				
                    MFS8633BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc.  |  
                260 | 
                
                     | 
                  
                  
                     -  | 	
                
                - | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 
| 
                 
                     
                 | 
				
                    MFS8610BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc.  |  
                260 | 
                
                     | 
                  
                  
                     -  | 	
                
                - | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 
                 
                     
                 
                
                 | 
				
                    MFS2613AMDA2ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc.  |  
                118 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MPF7100BVMA3ESPF7100 PMIC I.MX8DXP/DX NXP USA Inc.  |  
                260 | 
                
                     | 
                  
                  
                     -  | 	
                
                - | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 
| 
                 
                     
                 | 
				
                    MFS8600BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc.  |  
                260 | 
                
                     | 
                  
                  
                     -  | 	
                
                - | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS6523NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS4508NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |