| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                     
                 
                
                 | 
				
                    MC33FS6500CAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MPF5024CMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc.  |  
                490 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 
                 
                     
                 
                
                 | 
				
                    MC33FS4500LAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS4505CAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc.  |  
                240 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS6500LAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS6505CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC35FS6505NAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS4505LAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33FS6510LAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc.  |  
                250 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 
                 
                     
                 
                
                 | 
				
                    MC33PF3000A0ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc.  |  
                260 | 
                
                     | 
                  
                  
                    
                       Datasheet  | 	
                
                - | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |