| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Package Cooled | Attachment Method | Shape | Length | Width | Diameter | Fin Height | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                     
                 
                
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                    EA-330-H125-T710STD,EA-330-H125-T710, CLIP ATTAC Boyd Laconia, LLC  |  
                1,489 | 
                
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                EA-330 | Bulk | Active | Top Mount | BGA, FPGA | Clip | Square, Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | - | 0.492" (12.50mm) | - | 12.80°C/W @ 200 LFM | 31.40°C/W | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    530801B05100GBOARD LEVEL HEAT SINK Boyd Laconia, LLC  |  
                4,593 | 
                
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                       Datasheet  | 	
                
                - | Bulk | Active | Board Level, Vertical | TO-218, TO-247 | Bolt On and PC Pin | Rectangular, Fins | 1.840" (46.74mm) | 0.490" (12.44mm) | - | 1.750" (44.45mm) | 4.0W @ 30°C | 1.00°C/W @ 700 LFM | 6.30°C/W | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    576602D00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC  |  
                1,035 | 
                
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                       Datasheet  | 	
                
                - | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 0.950" (24.13mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | 4.0W @ 70°C | 9.00°C/W @ 200 LFM | 16.60°C/W | Aluminum | Tin | 
                 
                     
                 
                
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                    532802B02500GBOARD LEVEL HEAT SINK Boyd Laconia, LLC  |  
                3,166 | 
                
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                       Datasheet  | 	
                
                - | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | 6.0W @ 30°C | 2.00°C/W @ 200 LFM | 4.20°C/W | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    EA-330-H095-T710STD,EA-330-H095-T710, CLIP ATTAC Boyd Laconia, LLC  |  
                4,170 | 
                
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                EA-330 | Bulk | Active | Top Mount | BGA, FPGA | Clip | Square, Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | - | 0.374" (9.50mm) | - | 16.50°C/W @ 200 LFM | 37.30°C/W | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    11-5602-5111-5602-51 REV F Boyd Laconia, LLC  |  
                1,825 | 
                
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                - | Bulk | Active | Top Mount | BGA | Push Pin | Square, Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.453" (11.50mm) | - | - | 3.70°C/W | Brass | Black Anodized | 
                 
                     
                 
                
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                    6380BTHM,17500B-1G REV H Boyd Laconia, LLC  |  
                2,802 | 
                
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                - | Bulk | Active | Board Level, Vertical | TO-218, TO-220 | Bolt On and PC Pin | Rectangular, Fins | 1.650" (41.91mm) | 1.000" (25.40mm) | - | 1.000" (25.40mm) | 2.0W @ 20°C | 3.5°C/W @ 200 LFM | 6.80°C/W | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    2286BBOARD LEVEL HEAT SINK Boyd Laconia, LLC  |  
                3,858 | 
                
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                       Datasheet  | 	
                
                - | Bulk | Active | Board Level | BGA | Thermal Tape, Adhesive (Not Included) | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | - | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    EA-350-H245-T710EA-350-H245-T710 Boyd Laconia, LLC  |  
                2,410 | 
                
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                EA-350 | Bulk | Active | Top Mount | BGA, FPGA | Clip | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | 0.965" (24.50mm) | - | 7.30°C/W @ 200 LFM | 17.90°C/W | Aluminum | Black Anodized | 
                 
                     
                 
                
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                    2281BBOARD LEVEL HEAT SINK Boyd Laconia, LLC  |  
                3,020 | 
                
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                       Datasheet  | 	
                
                - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | Aluminum | Black Anodized |