Heat Sinks

制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
642-60AB

642-60AB

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,624
RFQ
642-60AB

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
529902B02100G

529902B02100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

1,406
RFQ
529902B02100G

Datasheet

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 30°C 1.50°C/W @ 500 LFM 4.50°C/W Aluminum Black Anodized
HSE-B20635-035H-W

HSE-B20635-035H-W

HEAT SINK, EXTRUSION, TO-220, 63

Same Sky (Formerly CUI Devices)

3,156
RFQ
HSE-B20635-035H-W

Datasheet

HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 2.500" (63.50mm) 1.378" (35.00mm) - 0.500" (12.70mm) 9.2W @ 75°C 4.35°C/W @ 200 LFM 8.15°C/W Aluminum Alloy Black Anodized
533722B02552G

533722B02552G

HEAT SINK

Boyd Laconia, LLC

2,565
RFQ
533722B02552G

Datasheet

- Bulk Active Board Level, Vertical TO-220 (Dual) Clip and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.70°C/W Aluminum Black Anodized
HSE-B630-04H

HSE-B630-04H

HEAT SINK, EXTRUSION, TO-220, 63

Same Sky (Formerly CUI Devices)

2,356
RFQ
HSE-B630-04H

Datasheet

HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.480" (63.00mm) 1.378" (35.00mm) - 1.000" (25.40mm) 14.4W @ 75°C 2.31°C/W @ 200 LFM 9.37°C/W Aluminum Alloy Black Anodized
ATS-PCBM1103

ATS-PCBM1103

BOARD LEVEL HEAT SINK

Advanced Thermal Solutions Inc.

3,084
RFQ

-

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 1.50°C/W @ 200 LFM 4.70°C/W Aluminum Black Anodized
HSE-B18508-035H-03

HSE-B18508-035H-03

HEAT SINK, EXTRUSION, TO-218, 50

Same Sky (Formerly CUI Devices)

3,356
RFQ
HSE-B18508-035H-03

Datasheet

HSE Box Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 2.000" (50.80mm) 1.638" (41.60mm) - 0.984" (25.00mm) 13.0W @ 75°C 3.44°C/W @ 200 LFM 5.77°C/W Aluminum Alloy Black Anodized
624-25ABT5

624-25ABT5

HEATSINK FOR 21MM BGA

Wakefield-Vette

2,526
RFQ
624-25ABT5

Datasheet

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
634-20AB

634-20AB

HEATSINK TO-220 VERT MT BLK 2.0"

Wakefield-Vette

1,562
RFQ
634-20AB

Datasheet

634 Bulk Active Board Level, Vertical TO-220, TO-218 Bolt On Rectangular, Fins 2.000" (50.80mm) 0.640" (16.26mm) - 0.640" (16.26mm) - - - Aluminum Black Anodized
TGH-0160-01

TGH-0160-01

ALUMINIUM HEAT SINK 16X16MM

t-Global Technology

1,354
RFQ
TGH-0160-01

Datasheet

TGH Bulk Obsolete Top Mount - - Square, Fins 0.630" (16.00mm) 0.630" (16.00mm) - 0.433" (11.00mm) - - - Aluminum Clean Anodized
624-45AB-T4E

624-45AB-T4E

HEATSINK CPU 21MM SQ

Wakefield-Vette

3,232
RFQ
624-45AB-T4E

Datasheet

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.450" (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum Black Anodized
ATS-PCBM1100

ATS-PCBM1100

BOARD LEVEL HEAT SINK

Advanced Thermal Solutions Inc.

2,477
RFQ

-

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 3.10°C/W @ 200 LFM 3.90°C/W Aluminum Black Anodized
642-35ABT1E

642-35ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

1,690
RFQ
642-35ABT1E

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
642-35ABT4E

642-35ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette

4,019
RFQ
642-35ABT4E

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
594302B02853G

594302B02853G

HEATSINK TO-220 W/KOOL CLIP BLK

Boyd Laconia, LLC

2,024
RFQ
594302B02853G

Datasheet

- Bulk Active Board Level, Vertical TO-220 Clip and Board Locks Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) - 0.480" (12.19mm) 6.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum Black Anodized
V2200N1-F-LP

V2200N1-F-LP

HEATSINK CPU W/ADHESIVE STAMPED

Assmann WSW Components

1,066
RFQ
V2200N1-F-LP

Datasheet

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.512" (13.00mm) - - - Aluminum Alloy Natural Anodized
6038DG

6038DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

2,256
RFQ
6038DG

Datasheet

- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 40°C 8.00°C/W @ 500 LFM 18.00°C/W Aluminum Tin
V2201N1-LP

V2201N1-LP

HEATSINK CPU STAMPED

Assmann WSW Components

3,085
RFQ
V2201N1-LP

Datasheet

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Fins 1.457" (37.00mm) 1.457" (37.00mm) - 0.551" (14.00mm) - - - Aluminum Alloy Natural Anodized
HSE-B18635-035H

HSE-B18635-035H

HEAT SINK, EXTRUSION,TO-218, 63.

Same Sky (Formerly CUI Devices)

3,658
RFQ
HSE-B18635-035H

Datasheet

HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) 16.7W @ 75°C 2.24°C/W @ 200 LFM 4.49°C/W Aluminum Alloy Black Anodized
HSE-B18635-035H-04

HSE-B18635-035H-04

HEAT SINK, EXTRUSION, TO-218, 63

Same Sky (Formerly CUI Devices)

4,033
RFQ
HSE-B18635-035H-04

Datasheet

HSE Box Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) 15.1W @ 75°C 2.38°C/W @ 200 LFM 4.97°C/W Aluminum Alloy Black Anodized
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