Solder

制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





























































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
NC191AX50

NC191AX50

SMOOTH FLOW LEADED SOLDER PASTE

Chip Quik Inc.

4,890
RFQ
NC191AX50

Datasheet

Smooth Flow™ Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 1.76 oz (50g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
RASW.015 100G

RASW.015 100G

SOLDER WIRE 63/37 TIN/LEAD ROSIN

Chip Quik Inc.

4,673
RFQ
RASW.015 100G

Datasheet

- Bulk Active Wire Solder Sn63Pb37 (63/37) 0.015" (0.38mm) 361°F (183°C) Rosin Activated (RA) 27 AWG, 28 SWG - Leaded Spool, 3.53 oz (100g) 60 Months Date of Manufacture -
BARSN60PB40-8OZ

BARSN60PB40-8OZ

SOLDER BAR SN60/PB40 8OZ 227G SU

Chip Quik Inc.

4,405
RFQ
BARSN60PB40-8OZ

Datasheet

Super Low Dross™ Bulk Active Bar Solder Sn60Pb40 (60/40) - 361 ~ 370°F (183 ~ 188°C) - - - Leaded Bar, 0.5 lb (227g) - - -
SMD2195-25000

SMD2195-25000

SOLDER SPHERES SN63/PB37 .022" (

Chip Quik Inc.

4,816
RFQ
SMD2195-25000

Datasheet

SMD2 Bulk Active Solder Sphere Sn63Pb37 (63/37) 0.022" (0.56mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
SMD2SWLF.015 2OZ

SMD2SWLF.015 2OZ

LF SOLDER WIRE 99.3/0.7 TIN/COPP

Chip Quik Inc.

3,007
RFQ
SMD2SWLF.015 2OZ

Datasheet

SMD2 Bulk Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.015" (0.38mm) 441°F (227°C) No-Clean, Water Soluble - - Lead Free Spool, 2 oz (56.70g) - - -
NC191LT35

NC191LT35

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

3,015
RFQ
NC191LT35

Datasheet

Smooth Flow™ Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD2170-25000

SMD2170-25000

SOLDER SPHERES SN63/PB37 .014" (

Chip Quik Inc.

4,904
RFQ
SMD2170-25000

Datasheet

SMD2 Bulk Active Solder Sphere Sn63Pb37 (63/37) 0.014" (0.36mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
SMD2150-25000

SMD2150-25000

SOLDER SPHERES SN63/PB37 .010" (

Chip Quik Inc.

3,553
RFQ
SMD2150-25000

Datasheet

SMD2 Bulk Active Solder Sphere Sn63Pb37 (63/37) 0.010" (0.25mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
SMD2055-25000

SMD2055-25000

SOLDER SPHERES SAC305 DIAMETER 2

Chip Quik Inc.

3,319
RFQ
SMD2055-25000

Datasheet

SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.025" (0.64mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
SMD2050-25000

SMD2050-25000

SOLDER SPHERES SAC305 .024" DIAM

Chip Quik Inc.

4,819
RFQ
SMD2050-25000

Datasheet

SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.024" (0.61mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
Total 486 Record«Prev1... 3031323334353637...49Next»
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER