Shenzhen JiaYouSheng Electronics Co., Ltd. - IC Sockets - Sockets for ICs, Transistors - page 869 - Original source of goods - Shenzhen JiaYouSheng Electronics Co., Ltd.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
APH-0440-G-H APH-0440-G-H Samtec Inc.	2,993	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1440-G-H APH-1440-G-H Samtec Inc.	1,876	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1940-G-H APH-1940-G-H Samtec Inc.	3,399	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0540-G-H APH-0540-G-H Samtec Inc.	2,367	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0640-G-H APH-0640-G-H Samtec Inc.	4,638	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1640-G-H APH-1640-G-H Samtec Inc.	3,091	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1240-G-H APH-1240-G-H Samtec Inc.	4,540	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0340-G-H APH-0340-G-H Samtec Inc.	4,429	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
510-93-176-15-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,526	-	RFQ	Datasheet	510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
517-83-539-20-101111 CONN SOCKET PGA 539POS GOLD Preci-Dip	3,344	-	RFQ	Datasheet	517	Bulk	Active	PGA	539 (20 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
APH-1832-G-H APH-1832-G-H Samtec Inc.	1,142	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1432-G-H APH-1432-G-H Samtec Inc.	2,677	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0932-G-H APH-0932-G-H Samtec Inc.	4,961	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1932-G-H APH-1932-G-H Samtec Inc.	3,773	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0832-G-H APH-0832-G-H Samtec Inc.	2,984	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0332-G-H APH-0332-G-H Samtec Inc.	2,599	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
517-93-223-18-098006 PGA SOCK 223 PIN 18X18 SOLDER TL Mill-Max Manufacturing Corp.	3,045	-	RFQ	Datasheet	517	Tube	Active	PGA	223 (18 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
145-PGM15024-40 CONN SOCKET PGA GOLD Aries Electronics	2,427	-	RFQ	Datasheet	PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
517-83-503-22-131111 CONN SOCKET PGA 503POS GOLD Preci-Dip	2,002	-	RFQ	Datasheet	517	Bulk	Active	PGA	503 (22 x 22)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
550-10-255M16-001152 BGA SOLDER TAIL Preci-Dip	1,727	-	RFQ	Datasheet	550	Bulk	Active	BGA	255 (16 x 16)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C

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