IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
44-6575-11

44-6575-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3,561
RFQ
44-6575-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
145-PGM15023-50

145-PGM15023-50

CONN SOCKET PGA GOLD

Aries Electronics

4,349
RFQ
145-PGM15023-50

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-43-952-61-008000

116-43-952-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,060
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-952-61-008000

116-93-952-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,255
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0536-G-H

APH-0536-G-H

APH-0536-G-H

Samtec Inc.

2,093
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1436-G-H

APH-1436-G-H

APH-1436-G-H

Samtec Inc.

4,702
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0936-G-H

APH-0936-G-H

APH-0936-G-H

Samtec Inc.

4,233
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1936-G-H

APH-1936-G-H

APH-1936-G-H

Samtec Inc.

2,059
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1236-G-H

APH-1236-G-H

APH-1236-G-H

Samtec Inc.

4,597
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1736-G-H

APH-1736-G-H

APH-1736-G-H

Samtec Inc.

3,809
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1336-G-H

APH-1336-G-H

APH-1336-G-H

Samtec Inc.

4,255
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0736-G-H

APH-0736-G-H

APH-0736-G-H

Samtec Inc.

4,846
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0836-G-H

APH-0836-G-H

APH-0836-G-H

Samtec Inc.

2,468
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1136-G-H

APH-1136-G-H

APH-1136-G-H

Samtec Inc.

4,801
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0236-G-H

APH-0236-G-H

APH-0236-G-H

Samtec Inc.

3,603
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0436-G-H

APH-0436-G-H

APH-0436-G-H

Samtec Inc.

2,610
RFQ

-

* - Active - - - - - - - - - - - - - - -
APO-632-G-B

APO-632-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,244
RFQ
APO-632-G-B

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0611-T-12

HLS-0611-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,389
RFQ
HLS-0611-T-12

Datasheet

HLS Bulk Active SIP 66 (6 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
614-83-225-17-061112

614-83-225-17-061112

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2,213
RFQ
614-83-225-17-061112

Datasheet

614 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-13-084-10-031001

510-13-084-10-031001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,900
RFQ
510-13-084-10-031001

Datasheet

510 Tube Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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