IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-93-950-61-003000

116-93-950-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,249
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-11-964-41-001000

123-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,057
RFQ
123-11-964-41-001000

Datasheet

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
36-3571-11

36-3571-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

1,537
RFQ
36-3571-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-3572-11

36-3572-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,513
RFQ
36-3572-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-3573-11

36-3573-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,958
RFQ
36-3573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-3574-11

36-3574-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,248
RFQ
36-3574-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6571-11

36-6571-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

1,370
RFQ
36-6571-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6572-11

36-6572-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,103
RFQ
36-6572-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6575-11

36-6575-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,407
RFQ
36-6575-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
510-93-114-13-062002

510-93-114-13-062002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,727
RFQ
510-93-114-13-062002

Datasheet

510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-114-13-062003

510-93-114-13-062003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,416
RFQ
510-93-114-13-062003

Datasheet

510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6508-21

32-6508-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,899
RFQ
32-6508-21

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
32-6508-31

32-6508-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,247
RFQ
32-6508-31

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
546-87-320-19-131147

546-87-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip

1,537
RFQ
546-87-320-19-131147

Datasheet

546 Bulk Active PGA 320 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1834-G-T

APH-1834-G-T

APH-1834-G-T

Samtec Inc.

2,945
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0934-G-T

APH-0934-G-T

APH-0934-G-T

Samtec Inc.

1,114
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1534-G-T

APH-1534-G-T

APH-1534-G-T

Samtec Inc.

3,734
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1934-G-T

APH-1934-G-T

APH-1934-G-T

Samtec Inc.

2,330
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0734-G-T

APH-0734-G-T

APH-0734-G-T

Samtec Inc.

3,448
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0234-G-T

APH-0234-G-T

APH-0234-G-T

Samtec Inc.

1,250
RFQ

-

* - Active - - - - - - - - - - - - - - -
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