IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1130-G-H

APH-1130-G-H

APH-1130-G-H

Samtec Inc.

3,475
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0230-G-H

APH-0230-G-H

APH-0230-G-H

Samtec Inc.

4,190
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0830-G-H

APH-0830-G-H

APH-0830-G-H

Samtec Inc.

1,526
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0330-G-H

APH-0330-G-H

APH-0330-G-H

Samtec Inc.

2,060
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1730-G-H

APH-1730-G-H

APH-1730-G-H

Samtec Inc.

4,721
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1630-G-H

APH-1630-G-H

APH-1630-G-H

Samtec Inc.

4,425
RFQ

-

* - Active - - - - - - - - - - - - - - -
111-43-950-61-001000

111-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,965
RFQ

-

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-950-61-001000

111-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,550
RFQ

-

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-650-61-001000

110-13-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,853
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-169-17-101101

550-10-169-17-101101

PGA SOLDER TAIL

Preci-Dip

1,619
RFQ
550-10-169-17-101101

Datasheet

550 Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-93-640-61-008000

116-93-640-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,535
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-668-41-005000

117-93-668-41-005000

CONN IC DIP SOCKET 68POS GOLD

Mill-Max Manufacturing Corp.

2,722
RFQ
117-93-668-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-41-121-13-061001

510-41-121-13-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,817
RFQ
510-41-121-13-061001

Datasheet

510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-952-61-001000

115-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,481
RFQ

-

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-83-225-17-003136

546-83-225-17-003136

CONN SOCKET PGA 225POS GOLD

Preci-Dip

3,954
RFQ
546-83-225-17-003136

Datasheet

546 Bulk Active PGA 225 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-43-432-61-001000

116-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,329
RFQ

-

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0417-T-10

HLS-0417-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,783
RFQ
HLS-0417-T-10

Datasheet

HLS Bulk Active SIP 68 (4 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-93-648-61-003000

116-93-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,926
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-964-41-003000

126-93-964-41-003000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

4,285
RFQ
126-93-964-41-003000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-964-41-003000

126-43-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,646
RFQ
126-43-964-41-003000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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