IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 10-HZW/TNCONN IC DIP SOCKET 4POS TIN Assmann WSW Components |
4,840 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR 50-HZL-TTSOCKET Assmann WSW Components |
3,154 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
A-CCS 032-Z-SM/TIC SOCKET, CHIP CARRIER, 1.27MM, Assmann WSW Components |
4,051 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PLCC | 32 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
|
AR 36-HGL-TTSOCKET Assmann WSW Components |
1,791 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR 52-HZL-TTSOCKET Assmann WSW Components |
4,982 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
A40-LCGCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
3,340 |
|
- |
- | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
|
AW 127-39/Z-TSOCKET 39 CONTACTS SINGLE ROW Assmann WSW Components |
3,517 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR 18-HZL/01-TTCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
1,698 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
A20-LCG-T-RCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
1,513 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
A-CCS32-Z-RCONN SOCKET PLCC 32POS TIN Assmann WSW Components |
1,506 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
