Shenzhen JiaYouSheng Electronics Co., Ltd. - IC Sockets - Sockets for ICs, Transistors - page 292 - Original source of goods - Shenzhen JiaYouSheng Electronics Co., Ltd.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
30-7360-10 CONN SOCKET SIP 30POS TIN Aries Electronics	4,316	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7365-10 CONN SOCKET SIP 30POS TIN Aries Electronics	3,228	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7374-10 CONN SOCKET SIP 30POS TIN Aries Electronics	2,191	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7375-10 CONN SOCKET SIP 30POS TIN Aries Electronics	4,270	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7400-10 CONN SOCKET SIP 30POS TIN Aries Electronics	1,779	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7430-10 CONN SOCKET SIP 30POS TIN Aries Electronics	3,085	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7435-10 CONN SOCKET SIP 30POS TIN Aries Electronics	1,087	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7437-10 CONN SOCKET SIP 30POS TIN Aries Electronics	3,180	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7472-10 CONN SOCKET SIP 30POS TIN Aries Electronics	3,641	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
30-7920-10 CONN SOCKET SIP 30POS TIN Aries Electronics	3,665	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C

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