IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
10-3513-11

10-3513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1,600
RFQ
10-3513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0513-10H

17-0513-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,463
RFQ
17-0513-10H

Datasheet

0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-C195-10T

14-C195-10T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,515
RFQ
14-C195-10T

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-422-41-012101

116-83-422-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,189
RFQ
116-83-422-41-012101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-632-41-134191

114-83-632-41-134191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,397
RFQ
114-83-632-41-134191

Datasheet

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-3518-11

20-3518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,422
RFQ
20-3518-11

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-322-41-009101

116-87-322-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,917
RFQ
116-87-322-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-424-41-035101

146-87-424-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,322
RFQ
146-87-424-41-035101

Datasheet

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D01-9951442

D01-9951442

CONN SOCKET SIP 14POS GOLD

Harwin Inc.

2,860
RFQ
D01-9951442

Datasheet

D01-995 Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
818-AG10D

818-AG10D

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

2,334
RFQ
818-AG10D

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
116-87-328-41-012101

116-87-328-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,088
RFQ
116-87-328-41-012101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-422-41-001101

122-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,440
RFQ
122-83-422-41-001101

Datasheet

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-422-41-001101

123-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

4,938
RFQ
123-83-422-41-001101

Datasheet

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-314-41-004101

116-83-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,371
RFQ
116-83-314-41-004101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-316-41-011101

116-83-316-41-011101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,042
RFQ
116-83-316-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
C9114-00

C9114-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,096
RFQ
C9114-00

Datasheet

Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
34-1518-10

34-1518-10

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

1,353
RFQ
34-1518-10

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
09-0517-90C

09-0517-90C

CONN SOCKET SIP 9POS GOLD

Aries Electronics

1,477
RFQ
09-0517-90C

Datasheet

0517 Bulk Active SIP 9 (1 x 9) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0205-T-22

HLS-0205-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,329
RFQ
HLS-0205-T-22

Datasheet

HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
1050282031

1050282031

CONN CAMERA SOCKET 32POS GOLD

Molex

2,212
RFQ
1050282031

Datasheet

105028 Tape & Reel (TR) Obsolete Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold Flash Copper Alloy Plastic -
Total 19086 Record«Prev1... 200201202203204205206207...955Next»
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER