| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | PLL | Main Purpose | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Grade | Qualification | Supplier Device Package | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| .jpg)  | DSC557-0334FI1MEMS OSC XO 100.0000MHZ HCSL LVD Microchip Technology | 255 |  |   Datasheet | DSC557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | PCI Express (PCIe) | - | HCSL, LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | - | 
|   | VSC8115XYA-06-TIC CLK DATA REC SDH 622MBPS Microchip Technology | 565 |  |   Datasheet | - | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | Tape & Reel (TR) | Active | Not Verified | No | SONET/SDH, DWDM | LVTTL | LVDS, LVPECL | 1 | 1:2 | Yes/Yes | 622Mbps | 3.135V ~ 3.465V | -40°C ~ 95°C | Surface Mount | - | - | 20-TSSOP | 
|   | SY87700ALHGIC CLK DATA REC SDH 208MBPS Microchip Technology | 132 |  |   Datasheet | AnyRate® | 32-TQFP Exposed Pad | Tray | Active | Not Verified | Yes | Ethernet, SONET/SDH, ATM applications | PECL, TTL | PECL | 1 | 3:3 | Yes/Yes | 208Mbps | 3.15V ~ 3.45V | -40°C ~ 85°C | Surface Mount | - | - | 32-TQFP-EP (7x7) | 
|  | ZL30635LDG15-CHANNEL, 10-OUTPUT SYNCE TIMIN Microchip Technology | 201 |  |   Datasheet | - | 64-VFQFN Exposed Pad | Tray | Active | Not Verified | Yes | Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | - | - | 64-VQFN (9x9) | 
| .jpg)  | DSC557-0343FI1MEMS OSC XO 100.0000MHZ HCSL LVD Microchip Technology | 624 |  |   Datasheet | DSC557-03 | 14-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | PCI Express (PCIe) | - | HCSL, LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | 14-QFN (2.5x3.2) | 
| .jpg)  | DSC557-0333FI1T2-OUTPUT MEMS PCIE GEN1/2/3/4 CL Microchip Technology | 1,230 |  |   Datasheet | DSC557-03 | 14-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Yes | PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | 14-QFN (2.5x3.2) | 
|   | DSC557-054444KI1IC CLOCK GEN PCIE 20VFQFN Microchip Technology | 109 |  |   Datasheet | DSC557-05 | 20-VFQFN Exposed Pad | Tube | Active | Not Verified | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:4 | No/Yes | 460MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | - | - | - | 
|   | MAX24188ETK2IC CLOCK SYNCHRONIZER 68TQFN Microchip Technology | 171 |  |   Datasheet | - | 68-WFQFN Exposed Pad | Tube | Active | Not Verified | Yes | Ethernet | Clock | Clock | 1 | 1:2 | No/No | 125MHz | 1.14V ~ 3.465V | -40°C ~ 85°C | Surface Mount | - | - | 68-TQFN (8x8) | 
|  | ZL30156GGG2PB FREE DUAL CH UNIV CLOCK TRANS Microchip Technology | 188 |  |   Datasheet | * | 64-BGA | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - | - | Surface Mount | - | - | 64-LBGA (9x9) | 
|   | ZL30122GGG2IC SONET/SDH SYNCH 64CABGA Microchip Technology | 812 |  |   Datasheet | - | 64-BGA | Tray | Active | Not Verified | Yes | SONET/SDH, Telecom | LVCMOS | LVCMOS, LVPECL | 1 | 6:5 | No/Yes | 622.08MHz | 2.97V ~ 3.63V | -40°C ~ 85°C | Surface Mount | - | - | 64-CABGA (9x9) |